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Magnetic Czochralski Technique

Category:Application Date of Release:Dec 26th 2017


The silicon wafers are made from high-purity monocrystalline silicon ingots, manufactured by the CZ (Czochralski) crystal growth process. Ingots up to 300mm in diameter are manufactured under the highest level of quality control.


If required by customers, we also make use of the MCZ (Magnetic Czochralski) technique, applying a strong magnetic field to the molten silicon, or the FZ (Float-Zone) technique whereby monocrystalline ingots are grown at low oxygen levels without using a quartz crucible.

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