Sputtering is a process whereby particles are ejected from a solid target material due to bombardment of the target by energetic particles, particularly gas ions in a laboratory. It only happens when the kinetic energy of the incoming particles is much higher than conventional thermal energies. Sputtering is the thin film deposition manufacturing process at the core of today's semiconductors industry.
Physical vapor deposition (PVD) describes a variety of vacuum deposition methods which can be used to produce thin films and coatings. PVD coatings are formed at relatively low temperatures (400-600°C). PVD is characterized by a process in which the material goes from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation. PVD is used in the manufacture of items which require thin films for mechanical, optical, chemical or electronic functions. Our magnetic fluid feedthrough also applied to PVD Equipment. Please contact us for more details.
The CVD device is one of the thin film forming devices, which deposits a thin film of about 10 to 1000 nm on the surface of the semiconductor.
Various types of gases are used as raw materials for the thin film, but they need to cause chemical reactions for thin film formation, and the use of heat, light and plasma is utilized as the means.
It uses many advantages of chemical vapor deposition, such as rapid deposition rates, large processing areas, and uneven film formation.
Ion Implantation Equipment
Ion implantation is low-temperature process by which ions of one element are accelerated into a solid target, thereby changing the physical, chemical, or electrical properties of the target. Ion implantation is used in semiconductor device fabrication and in metal finishing, as well as in materials science research. The ions can alter the elemental composition of the target (if the ions differ in composition from the target) if they stop and remain in the target. Ion implantation cause also chemical and physical changes when the ions impinge on the target at high energy.
A vacuum furnace is a type of furnace in which the product in the furnace is surrounded by a vacuum during processing. The absence of air or other gases prevents oxidation, heat loss from the product through convection, and removes a source of contamination. There is merit such as being able to perform the de-foaming process and to prevent uneven heating etc. Distortion of work pieces can be suppressed. Vacuum furnaces are used to carry out processes such as annealing, brazing, sintering and heat treatment with high consistency and low contamination.
Since heating is performed while pulling with a vacuum pump, it is possible to remove the gas adhering to the processed product itself. Our magnetic fluid feedthrough is applied to the rotation introduction part of the fan for circulating the pressurized gas. Magnetic fluid seal designed by our proprietary analytical technology enables high load resistance and high torque transmission.
Vacuum Robotics is able to do carrying process under vaccum environment. It can carrying and handling liquid crystal display, OELD, and semiconductor manufacturing industry. We have applied numerous magnetic fluid feedthrough to vacuum robotics so far. Please feel free to contact us, we are able to design based on customer's needs.
Magnetic Czochralski Technique
The silicon wafers are made from high-purity monocrystalline silicon ingots, manufactured by the CZ (Czochralski) crystal growth process. Ingots up to 300mm in diameter are manufactured under the highest level of quality control.
About Magnetic Fluid Feedthrough
Under the condition of shaft rotation, a magnetic fluid feedthrough provides a hermetic seal against both vacuum and gas.
A magnetic loop consists of the magnet, poles and the shaft. Several stages of liquid "O-ring" are formed by the gathering of the magnetic fluid between the poles and the shaft in the presence of magnetic field. Each stage can sustain a pressure of 0.2kgf/cm2. There are normally 10 to 20 stages in the sealing part of the feedthrough.
About Magnetic Fluid
Magnetic fluid consists of sub-micron particles of Fe3O4 (other paramagnetic metallic oxides), surfactant and carrier liquid, etc. The surface of the particle is coated with surfactant, so that the magnetic particle is able to be dispersed stably in the liquid. Thus, it becomes a liquid of stable suspensibility. Because the liquid contains super-paramagnetic particles, it acts magnetically as a whole though it is a liquid.